Partager

Analyse de la performance d'un système à compression de vapeur à petite échelle pour le refroidissement des applications électroniques : un montage expérimental.

Performance analysis of a miniature-scale vapour compression system for electronics cooling: bread board setup.

Auteurs : TRUTASSANAWIN S., CREMASCHI L., GROLL E. A., et al.

Résumé

A miniature-scale vapour compression refrigeration system was developed and experimentally investigated for electronics cooling. The system consists of four main components: a micro-channel cold plate evaporator-heat spreader, a compressor, a micro-channel condenser, and an expansion device. Experimental results obtained with the bread board system demonstrate the feasibility of applying a miniature-scale refrigeration system in cooling compact electronic devices. Moreover, the performance of each component and of the overall system were quantified and used to improve the efficiencies of components and system. The cooling capacity of the investigated system varied from 121 to 268 W, with a COP of 2.8 to 4.7, at pressure ratios of 1.9 to 3.2. The effectiveness of the condenser ranged from 52 to 77%, while a thermal resistance between 0.60 and 0.77 K cm2/W was achieved at the evaporator. The evaporator-heat spreader thermal resistance is defined as the ratio of the temperature difference between the chip surface and the refrigerant evaporator to the evaporator heat transfer rate. The overall system thermal resistance, defined as the ratio of the temperature difference between the chip surface and the condenser air inlet, varied from 0.04 to 0.18 K cm2/W. An overall second-law efficiency ranging from 33 and 52% was obtained, using a commercially available small-scale compressor. The measured overall isentropic efficiency was between 25 and 60%.

Documents disponibles

Format PDF

Disponible

  • Prix public

    20 €

  • Prix membre*

    15 €

* meilleur tarif applicable selon le type d'adhésion (voir le détail des avantages des adhésions individuelles et collectives)

Détails

  • Titre original : Performance analysis of a miniature-scale vapour compression system for electronics cooling: bread board setup.
  • Identifiant de la fiche : 2008-2265
  • Langues : Anglais
  • Source : 2006 Purdue Conferences. 18th International Compressor Engineering Conference at Purdue & 11th International Refrigeration and Air-Conditioning Conference at Purdue [CD-ROM].
  • Date d'édition : 17/07/2006

Liens


Voir d'autres communications du même compte rendu (157)
Voir le compte rendu de la conférence

Indexation