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Mini-système à cycle à vapeur pour les applications de refroidissement des dispositifs électroniques à haute densité.

Mini vapour cycle system for high density electronic cooling applications.

Numéro : pap. 2317

Auteurs : MANCIN S., ZILIO C., ROSSETTO L.

Résumé

This paper reports the preliminary experimental results of a mini vapour cycle system for electronic thermal management applications. The water cooled miniature scale refrigeration system uses R134a as working fluid and implements a new concept oil-free linear compressor prototype. In the range of operating test conditions investigated, the cooling capacity of the system varied from 46 to 310 W while the coefficient of performance (COP) ranged between 1.05 and 5.54. Particular attention was dedicated to the cold plate design, which had to meet the requirements established by the aeronautical standards. The cold plate was equipped with 15 thermocouples in order to analyze the wall temperatures distribution. The suitability and feasibility of the proposed cold plate for electronic thermal management in aeronautical environment is critically discussed, basing on the experimental results.

Documents disponibles

Format PDF

Pages : 8 p.

Disponible

  • Prix public

    20 €

  • Prix membre*

    15 €

* meilleur tarif applicable selon le type d'adhésion (voir le détail des avantages des adhésions individuelles et collectives)

Détails

  • Titre original : Mini vapour cycle system for high density electronic cooling applications.
  • Identifiant de la fiche : 30006176
  • Langues : Anglais
  • Source : 2012 Purdue Conferences. 14th International Refrigeration and Air-Conditioning Conference at Purdue.
  • Date d'édition : 16/07/2012

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