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Amélioration du transfert de chaleur en ébullition sur les surfaces biphiles.

Boiling Heat Transfer Enhancement on Biphilic Surfaces.

Auteurs : CHINNOV E. A., KHMEL S. Y., VLADIMIROV V. Y., SAFONOV A. I., SEMIONOV V. V., EMELYANENKO K. A., EMELYANENKO A. M., BOINOVICH L. B.

Type d'article : Article de périodique

Résumé

Flat surfaces with different patterns of hydrophobic spots were employed for experimental investigation of boiling heat transfer. In one case, hydrophobic spots were created on a smooth copper surface and on a surface coated with arrays of micrococoons from silicon oxide nanowires by vapor deposition of a fluoropolymer. In the second case, a hydrophobic coating was deposited on heater surfaces with cavity microstructures formed by laser ablation and chemisorption of fluorinated methoxysilane. Water under saturation conditions at atmospheric pressure was used as the working liquid. The temperature of the heating surface was varied from 100 to 125 °C, and the maximum value of the heat flux was 160 W/cm2. Boiling heat transfer on the test biphilic surfaces was significantly (up to 600%) higher than on non-biphilic surfaces. Surface texture, the shape of hydrophobic regions, and the method of their creation tested in this study did not show a significant effect on heat transfer. The boiling heat transfer rate was found to depend on the size of hydrophobic spots, the distance between them, and hence the number of spots. The highest heat transfer efficiency was detected for the surface with the largest number of hydrophobic spots. After long-term experiments (up to 3 years), the heat transfer coefficient on the obtained surfaces remained higher than on the smooth copper surface. Biphilic surfaces with arrays of cavities formed by laser ablation turned out to be the most stable during prolonged contact with boiling water.

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Pages : 19 p.

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Détails

  • Titre original : Boiling Heat Transfer Enhancement on Biphilic Surfaces.
  • Identifiant de la fiche : 30030586
  • Langues : Anglais
  • Sujet : Technologie
  • Source : Energies - vol. 15 - n. 19
  • Éditeurs : MDPI
  • Date d'édition : 10/2022
  • DOI : http://dx.doi.org/10.3390/en15197296

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