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Contrôle thermique de composants électroniques par caloducs.

Thermal control of electronic equipment by heat pipes.

Auteurs : GROLL M., SCHNEIDER M., SARTRE V., CHAKER-ZAGHDOUDI M., LALLEMAND M.

Type d'article : Article

Résumé

A literature survey on the main heat pipe and micro heat pipe technologies developed for thermal control of electronic equipment has been carried out. The conventional heat pipes are cylindrical, flat or bellow tubes, using wicks or axial grooves as capillary structures. In the field of micro heat pipes, three and four corner tubes have been developed.The pipes are mounted on single chips, in-line chip arrays or integrated into the component interconnection substrate. The best performances were achieved with Plesch's axially grooved flat miniature heat pipe, which is able to transfer a heat flux of about 60 watts/cm2.

Détails

  • Titre original : Thermal control of electronic equipment by heat pipes.
  • Identifiant de la fiche : 1999-1483
  • Langues : Anglais
  • Source : Rev. gén. Therm. - vol. 37 - n. 5
  • Date d'édition : 05/1998

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