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Développement et validation d'un modèle résistance-capacitance (RCM) pour un matériau à changement de phase (MCP) intégré dans des structures périodiques tridimensionnelles.

Development and validation of resistance-capacitance model (RCM) for phase change material (PCM) embedded in 3D periodic structures.

Numéro : 2147

Auteurs : ALAM T., RIGHETTI G., BACELLAR D., AUTE V., MANCIN S.

Résumé

The low thermal conductivity of Phase Change Materials (PCM) can be improved with extended surfaces such as additively manufactured 3D periodic lattice structures. Three different aluminum alloy-based lattices (base sizes 10, 20, and 40 mm) with average porosity of 0.95 filled with paraffin wax, with a nominal phase change temperature of 55°C, were experimentally investigated. In this work, a computationally efficient 2D Resistance Capacitance-based model (RCM) was developed for predicting the thermal characteristics of these geometries. Non-uniform porosity in the PCM-metal domain was estimated using image processing and served as model input. The solver does not solve for higher-order physics as in CFD but still can provide a good prediction of thermal resistance and energy storage at very low computational cost. The simulation-to-real-time factor for this geometry is of the order of 10-4, while CFD simulations typically have a real-time factor greater than 1. The model was validated against the experimental data for melting under three different heat fluxes (6250 W/m2, 12500 W/m2 and 18750 W/m2). The mean deviation of the predicted average PCM temperature was between 1.34 K-2.81 K for different cases. The maximum average temperature deviation of 5.45 K was observed for the 20 mm geometry at the highest heat flux test condition. The effects of natural convection were neglected in the model, but the predicted PCM temperature and energy storage still showed good agreement with the experimental data.

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Pages : 10 p.

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  • Titre original : Development and validation of resistance-capacitance model (RCM) for phase change material (PCM) embedded in 3D periodic structures.
  • Identifiant de la fiche : 30030489
  • Langues : Anglais
  • Sujet : Technologie
  • Source : 2022 Purdue Conferences. 19th International Refrigeration and Air-Conditioning Conference at Purdue.
  • Date d'édition : 10/07/2022

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