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Étude expérimentale du refroidissement temporaire des composants électroniques à l'aide de dispositifs composites, à structure régulière, d'accumulation thermique de la chaleur latente.

Experimental investigation of temporary electronics cooling with regularly structured composite latent heat storage.

Auteurs : LOHSE E., SCHMITZ G.

Type d'article : Article

Résumé

This study shows results of the experimental investigation of regularly structured composite latent heat storage. Common solid–liquid phase change materials used as latent heat storages have a low thermal conductivity, which leads to high temperature differences inside large phase change material volumes. This drawback is compensated by the combination with specially designed frame structures made of aluminum to enhance the transport of thermal energy inside the regularly structured composite latent heat storage. A prototype is investigated experimentally on a test rig, where the heat load and temperatures are measured while the phase change process is observed optically. The experimental data are compared to a solid block phase change material heat storage and to the results of a transient Finite Element Method (FEM) simulation.

Détails

  • Titre original : Experimental investigation of temporary electronics cooling with regularly structured composite latent heat storage.
  • Identifiant de la fiche : 30010563
  • Langues : Anglais
  • Source : HVAC&R Research - vol. 19 - n. 7
  • Date d'édition : 10/2013
  • DOI : http://dx.doi.org/10.1080/10789669.2013.828979

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