Partager

Document IIF

Experimental investigation and thermal optimisation of two-phase immersion cooling based on a micro heat pipe array for chips.

Auteurs : REN H., QUAN Z., ZHAO J., ZHAO Y.

Type d'article : Article de la RIF

Résumé

As data center power density continues to increase, the thermal management of high heat-flux chips becomes a major challenge. To improve the efficiency of two-phase immersion cooling, this study experimentally in vestigates a MHPA-based cooling system and proposes two optimization strategies addressing geometric design and boiling enhancement. The MHPA is directly attached to the chip surface to exploit its high thermal conductivity and uniform temperature distribution, effectively expanding the active boiling area. Experimental results reveal that increasing the MHPA height from 6 cm to 12 cm enlarges the effective boiling area by 104.16% and enhances the CHF by 95.8%. Introducing a metal-mesh confined space strengthens nucleate boiling under low heat flux (q ≤ 20 W/cm²), improving the average heat transfer performance by 10.55%. The proposed optimization framework demonstrates a compact, efficient, and architecture-compatible cooling approach for next-generation high-power data center servers.

Documents disponibles

Format PDF

Pages : 14

Disponible

  • Prix public

    20 €

  • Prix membre*

    Gratuit

* meilleur tarif applicable selon le type d'adhésion (voir le détail des avantages des adhésions individuelles et collectives)

Détails

  • Titre original : Experimental investigation and thermal optimisation of two-phase immersion cooling based on a micro heat pipe array for chips.
  • Identifiant de la fiche : 30034844
  • Langues : Anglais
  • Sujet : Technologie
  • Source : International Journal of Refrigeration - Revue Internationale du Froid - vol. 187
  • Date d'édition : 07/2026
  • DOI : http://dx.doi.org/10.1016/j.ijrefrig.2026.106958

Liens


Voir d'autres articles du même numéro (35)
Voir la source

Indexation