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Document IIF

Traitements hydrophiles d'ailettes en cuivre.

Hydrophilic treatments of copper fin material.

Auteurs : MIN J., SHEN L., GAO F., et al.

Résumé

This work addresses efforts to provide wettability of water on copper foil. The application of specific interest is fins used in dehumidifying heat exchangers including evaporators and cooling coils. Various types of surface treatments were attempted to promote the wettability of copper, they included the solution treatment, air heating treatment, and others, all of which belong to the chemical treatment and were based on the principle of generating cupric compound on copper surface. In the solution treatment, the copper sample was immersed in a mixed solution of sodium hydroxide and potassium persulphate at room temperature for 10-30 min, while in the air heating treatment, the copper sample was heated in air to a temperature of 150-320°C and the temperature was maintained for 2-5 min. The test results showed that both treatments were effective in promoting the surface wettability of copper foil.

Documents disponibles

Format PDF

Pages : ICR07-E1-739

Disponible

  • Prix public

    20 €

  • Prix membre*

    Gratuit

* meilleur tarif applicable selon le type d'adhésion (voir le détail des avantages des adhésions individuelles et collectives)

Détails

  • Titre original : Hydrophilic treatments of copper fin material.
  • Identifiant de la fiche : 2008-0095
  • Langues : Anglais
  • Source : ICR 2007. Refrigeration Creates the Future. Proceedings of the 22nd IIR International Congress of Refrigeration.
  • Date d'édition : 21/08/2007

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