Transfert de chaleur lors de l'ébullition en écoulement saturé et caractéristiques bullaires associées de FC-72 sur une puce en silicone à micro-picots et ailettes chauffée.
Saturated flow boiling heat transfer and associated bubble characteristics of FC-72 on a heated micro-pin-finned silicon chip.
Auteurs : LIE Y. M., KE J. H., CHANG W. R., et al.
Type d'article : Article
Résumé
An experiment is carried out here to investigate flow boiling heat transfer and associated bubble characteristics of FC-72 on a heated micro-pin-finned silicon chip flush-mounted in the bottom of a horizontal rectangular channel. Besides, three different micro-structures of the chip surface are examined, namely, the smooth, pin-finned 200 and pin-finned 100 surfaces. The pitch of the fins is equal to the fin width for both surfaces. The effects of the FC-72 mass flux, imposed heat flux, and surface microstructures of the silicon chip on the FC-72 saturated flow boiling characteristics are examined in detail. The experimental data show that an increase in the FC-72 mass flux causes a delay in the boiling incipience. However, the flow boiling heat transfer coefficient is not affected by the coolant mass flux. But adding the micro-pin-fin structures to the chip surfaces can effectively enhance the single-phase convection and flow boiling heat transfer. Moreover, the mean bubble departure diameter and active nucleation site density are reduced for a rise in the FC-72 mass flux. A higher coolant mass flux results in a higher mean bubble departure frequency. Furthermore, larger bubble departure diameter, higher bubble departure frequency, and higher active nucleation site density are observed at a higher imposed heat flux. We also note that adding the micro-pin-fins to the chips decrease the bubble departure diameter and increase the bubble departure frequency. However, the departing bubbles are larger for the pin-finned 100 surface than the pin-finned 200 surface but the bubble departure frequency exhibits an opposite trend. Finally, empirical equations to correlate the present data for the FC-72 single-phase liquid convection and saturated flow boiling heat transfer coefficients and for the bubble characteristics are provided. [Reprinted with permission from Elsevier. Copyright, 2007].
Détails
- Titre original : Saturated flow boiling heat transfer and associated bubble characteristics of FC-72 on a heated micro-pin-finned silicon chip.
- Identifiant de la fiche : 2008-0540
- Langues : Anglais
- Source : International Journal of Heat and Mass Transfer - vol. 50 - n. 19-20
- Date d'édition : 09/2007
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Indexation
- Thèmes : Transfert de masse
- Mots-clés : Surface augmentée; Électronique; Transfert de chaleur; Refroidissement; FC-72; Experimentation; Ébullition; Composant
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