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Analyse du transfert de chaleur d'un refroidisseur à adsorption fonctionnant grâce à la chaleur.

Overall of heat transfer analyses of a heat-driven adsorption chiller.

Numéro : pap. P07

Auteurs : THU K., NG K. C., SAHA B. B., et al.

Résumé

This paper presents the performance of a heat-driven adsorption (AD) chiller that utilizes a low temperature hot water which can be extracted from either an exhaust of processes or the solar thermal energy. The AD plant employs the silica gel-water as the adsorbent-adsorbate pair. The main advantages of the AD cycle are: (i) it has almost no major moving parts, (ii) it has low maintenance and (iii) it is environmental friendly. Extensive experimental tests have been conducted on a 2-bed pilot adsorption chiller at assorted heat source temperatures of 60-85°C, cooling and chilled water temperatures of 30 and 12.5°C, respectively. The performance of the chiller is evaluated in terms of the heat transfer coefficients of adsorption, desorption, evaporation and condensation processes. These parameters in-turn determine the specific cooling capacity (SCC) and the coefficient of the performance (COP) of the chiller. It is observed that the overall heat transfer coefficients of the processes have a direct linear relation with the hot water inlet temperatures, defying the general conception of constant values of these processes. The data has direct implications in the simulation program that is used to predict the general performances of AD chillers.

Documents disponibles

Format PDF

Pages : 10 p.

Disponible

  • Prix public

    20 €

  • Prix membre*

    15 €

* meilleur tarif applicable selon le type d'adhésion (voir le détail des avantages des adhésions individuelles et collectives)

Détails

  • Titre original : Overall of heat transfer analyses of a heat-driven adsorption chiller.
  • Identifiant de la fiche : 30000602
  • Langues : Anglais
  • Source : Measures to address climate change. 2010 International Symposium on Next-generation Air Conditioning and Refrigeration Technology: February 17-19, Tokyo, Japan.
  • Date d'édition : 17/02/2010

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