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Dernières avancées dans la recherche et l'évaluation des techniques de refroidissement des composants électroniques.

[In Chinese. / En chinois.]

Auteurs : LI T., LIU J.

Type d'article : Article

Résumé

Improvement on the chip integration density has to face the restriction inherent in the thermal barrier caused by the heat generation within the electronic elements. Recently, with the rapid progress of the micro/nano electronics, requirements in terms of high performance chip cooling techniques have become more significant. Efforts made in this direction have led to the establishment of a series of exciting new methods. Based on the analysis of the heat generation mechanisms of the electronic elements, the newly emerging chip cooling techniques and their practical applications are reviewed. Advantages and shortcomings of these methods and the relative critical issues are evaluated. Prospects in the chip cooling area are also discussed.

Documents disponibles

Format PDF

Pages : 22-32

Disponible

  • Prix public

    20 €

  • Prix membre*

    15 €

* meilleur tarif applicable selon le type d'adhésion (voir le détail des avantages des adhésions individuelles et collectives)

Détails

  • Titre original : [In Chinese. / En chinois.]
  • Identifiant de la fiche : 2005-2836
  • Langues : Chinois
  • Source : Journal of Refrigeration - n. 3
  • Date d'édition : 2004

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