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Latest research advancement and assessment of chip cooling techniques.

[In Chinese. / En chinois.]

Author(s) : LI T., LIU J.

Type of article: Article

Summary

Improvement on the chip integration density has to face the restriction inherent in the thermal barrier caused by the heat generation within the electronic elements. Recently, with the rapid progress of the micro/nano electronics, requirements in terms of high performance chip cooling techniques have become more significant. Efforts made in this direction have led to the establishment of a series of exciting new methods. Based on the analysis of the heat generation mechanisms of the electronic elements, the newly emerging chip cooling techniques and their practical applications are reviewed. Advantages and shortcomings of these methods and the relative critical issues are evaluated. Prospects in the chip cooling area are also discussed.

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Format PDF

Pages: 22-32

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Details

  • Original title: [In Chinese. / En chinois.]
  • Record ID : 2005-2836
  • Languages: Chinese
  • Source: Journal of Refrigeration - n. 3
  • Publication date: 2004

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