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Développement d'un système de refroidissement pour les températures ambiantes élevées à partir de la technologie des microprocesseurs.

Development of a cooling unit for high ambient temperatures based on microcompressor technology.

Numéro : pap. 2236

Auteurs : RIBEIRO G. B.

Résumé

A good matching between size and efficiency is a desirable design feature of cooling units for electronic systems, due to high capacity to size ratio and small weight. For this purpose, Embraco developed a new refrigerating system for small enclosures and telecommunication stations, which makes use of a new miniaturized linear microcompressor. The air-conditioning cooling unit consists of finned-tube heat exchangers and a direct current (DC) oil-free microcompressor that uses R134a as the refrigerant. The paper presents a detailed description of the cooling unit and performance tests. A novel refrigerating cycle for thermal management of the microcompressor was created especially for high ambient temperatures. In order to run all experimental tests, a cooling unit calorimeter was assembled. In the experimental facility, the ambient temperature was varied (25, 35 and 55°C) and the bulk temperature inside the enclosure was controlled via an electric heater. Commercially available thermoelectric systems used for electronics cooling were also compared with the vapor compression system. The results have shown that the microcompressor unit presented a coefficient of performance (COP) approximately two times larger than thermoelectric solutions.

Documents disponibles

Format PDF

Pages : 10 p.

Disponible

  • Prix public

    20 €

  • Prix membre*

    15 €

* meilleur tarif applicable selon le type d'adhésion (voir le détail des avantages des adhésions individuelles et collectives)

Détails

  • Titre original : Development of a cooling unit for high ambient temperatures based on microcompressor technology.
  • Identifiant de la fiche : 30006174
  • Langues : Anglais
  • Source : 2012 Purdue Conferences. 14th International Refrigeration and Air-Conditioning Conference at Purdue.
  • Date d'édition : 16/07/2012

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