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Modèle de réseau de résistance-capacitance thermique pour une simulation rapide des dispositifs à revêtement déshydratant utilisés pour un refroidissement de composants électroniques efficace.

Thermal resistance-capacitance network model for fast simulation on the desiccant coated devices used for effective electronic cooling.

Auteurs : LIU H. R., HUA B. J., WANG C. X., WANG R. Z.

Type d'article : Article de la RIF

Résumé

Numerous novel devices have already utilized desiccant coating to implement various functions, such as atmospheric water harvesting, energy storage, and thermal/humidity management. The mathematical models employed in former literature, for instance the finite-element or finite-volume models usually suffer significant drawbacks such as extreme complexity and time-consuming. To solve this problem, this paper outlines a general strategy to develop dynamic compact thermal models of the quasi-one-dimensional sorption-based systems in the virtue of the thermal resistance-capacitance network. To be specific, the mass transfer process induced by the adsorption/desorption process is equivalent to a heat/cooling source, therefore the coupled heat and mass transfer kinetics in the corresponding device can be evaluated simultaneously. Two comprehensive experimental prototypes in our previous literature are employed to validate the effectiveness of the proposed model. The results show that our model can forecast the transient thermal behavior of the devices accurately within a few seconds. The dynamic deviation of the system output, for instance the material temperature and outlet air humidity, between simulation and experiment is within 7%. Furthermore, a parametric study is conducted based on the proposed model to analyze the influence of key parameters on system performance, showing great potential for guiding the system design and optimization.

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Format PDF

Pages : 78-86

Disponible

  • Prix public

    20 €

  • Prix membre*

    Gratuit

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Détails

  • Titre original : Thermal resistance-capacitance network model for fast simulation on the desiccant coated devices used for effective electronic cooling.
  • Identifiant de la fiche : 30029112
  • Langues : Anglais
  • Sujet : Technologie
  • Source : International Journal of Refrigeration - Revue Internationale du Froid - vol. 131
  • Date d'édition : 11/2021
  • DOI : http://dx.doi.org/10.1016/j.ijrefrig.2021.07.038
  • Document disponible en consultation à la bibliothèque du siège de l'IIF uniquement.

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