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Modélisation et simulation d’une pompe à chaleur thermoélectrique avec transfert de chaleur dans des microcanaux

Modelling and simulation of a thermoelectric heat pump with micro-channel heat transfer.

Numéro : 0282

Auteurs : WAN H., SHEN B., GLUESENKAMP K. R., LI Z.

Résumé

Thermoelectric heat pumps (TEHPs) have advantages of modularity and simple design for heating and cooling in some applications. Models of thermoelectric (TE) heat pumps are widely studied. Nevertheless, most existing modeling work focuses on the TE material or air-sourced TE modules. TEHP modeling, especially the relationship between modules and heat exchangers, has not been comprehensively conducted. This work presents a water-to-water TEHP modeling framework that combines Goldsmid’s approach for TE material performance, Gnielinski’s correlation for convective heat transfer, and thermal balance theory for heat exchange networks. This combined framework provides an accurate theoretical analysis of the water-to-water TEHP system. Subsequently, the framework was used to empirically determine TE material properties (electric resistivity, thermal conductivity, and Seebeck coefficient) that minimize modeling errors versus experimentally observed values from the literature. Finally, an additional set of experimental TEHP data was used to validate the model, all with relative absolute deviations of approximately 10% when predicting heating capacity and 10%–20% when forecasting cooling capacity at a 30 K temperature lift. For future work, people can further develop models of TEHPs with an air-based heat sink on one side and water channels on the other side.

Documents disponibles

Format PDF

Pages : 9 p.

Disponible

  • Prix public

    20 €

  • Prix membre*

    Gratuit

* meilleur tarif applicable selon le type d'adhésion (voir le détail des avantages des adhésions individuelles et collectives)

Détails

  • Titre original : Modelling and simulation of a thermoelectric heat pump with micro-channel heat transfer.
  • Identifiant de la fiche : 30031117
  • Langues : Anglais
  • Sujet : Technologie
  • Source : 14th IEA Heat Pump Conference 2023, Chicago, Illinois.
  • Date d'édition : 15/05/2023

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