Résumé
The challenge of effectively removing high heat flux from microelectronic chips may hinder future advancements in the semiconductor industry. Spray cooling is a promising solution to dissipate high heat flux, but traditional sprays suffer from low cooling efficiency partly because of droplet rebound. Here we show that electrosprays provide highly efficient cooling by completely avoiding the droplet rebound, when the electrically charged droplets are pinned on the heated conducting surface by the electric image force. We demonstrate a cooling system consisting of microfabricated multiplexed electrosprays in the cone-jet mode generating electrically charged microdroplets that remove a heat flux of 96 W/cm2 with a cooling efficiency reaching 97%. Scale-up considerations suggest that the electrospray approach is well suited for practical applications by increasing the level of multiplexing and by preserving the system compactness using microfabrication. [Reprinted with permission from Elsevier. Copyright, 2011.]
Détails
- Titre original : Electrospray cooling for microelectronics.
- Identifiant de la fiche : 30001814
- Langues : Anglais
- Source : International Journal of Heat and Mass Transfer - vol. 54 - n. 11-12
- Date d'édition : 05/2011
- DOI : http://dx.doi.org/10.1016/j.ijheatmasstransfer.2011.02.038
Liens
Voir d'autres articles du même numéro (8)
Voir la source
Indexation
-
Extended studies of spray cooling with R113.
- Auteurs : HOLMAN J. P., KENDALL C. M.
- Date : 05/1993
- Langues : Anglais
- Source : International Journal of Heat and Mass Transfer - vol. 36 - n. 8
Voir la fiche
-
Cooling effectiveness of droplets at low Weber ...
- Auteurs : STROTOS G., NIKOLOPOULOS N., NIKAS K. S., et al.
- Date : 10/2013
- Langues : Anglais
- Source : International Journal of thermal Sciences - vol. 72
Voir la fiche
-
Single nozzle spray cooling heat transfer mecha...
- Auteurs : HORACEK B., KIGER K. T., KIM J.
- Date : 04/2005
- Langues : Anglais
- Source : International Journal of Heat and Mass Transfer - vol. 48 - n. 8
Voir la fiche
-
IMMERSION COOLING OF ELECTRONICS IN FLUIDIZED B...
- Auteurs : BROWN R. C., JASPER S. S.
- Date : 1989
- Langues : Anglais
- Source : Heat Transf. Eng. - vol. 10 - n. 3
Voir la fiche
-
Heat transfer regime map for electronic devices...
- Auteurs : FUSHINOBU K., HIJIKATA K., KUROSAKI Y.
- Date : 10/1996
- Langues : Anglais
- Source : International Journal of Heat and Mass Transfer - vol. 39 - n. 15
Voir la fiche