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Synthèse approfondie de la gestion thermique dans les systèmes électroniques utilisant l’effet piézoélectrique inverse.

Thermal management in electronic systems using the inverse piezoelectric effect: A comprehensive review.

Auteurs : MEHREZ Z., ELFALLEH W.

Type d'article : Article de la RIF

Résumé

The rapid miniaturization of electronic devices has led to increased power densities and significant heat generation, making efficient thermal management a critical challenge. This review explores the potential of piezoelectric materials, operating via the inverse piezoelectric effect, as compact and energy-efficient cooling solutions for modern electronics. By converting electrical input into mechanical deformation, piezoelectric devices such as fans, micropumps, micro-blowers, synthetic jets, and translational agitators enhance heat dissipation through mechanisms like fluid agitation, directed airflow, and dynamic thermal interface modulation. These systems offer silent operation, low power consumption, fast thermal response, and high reliability, making them well-suited for space-constrained and noise-sensitive applications, including laptops, tablets, and wearable technologies. The integration of piezoelectric devices into smart thermal management systems further enables real-time adaptation to thermal loads. This review highlights recent advancements, assesses the benefits and limitations of current technologies, and outlines future directions for next-generation electronic cooling solutions.

Documents disponibles

Format PDF

Pages : 21 p.

Disponible

  • Prix public

    20 €

  • Prix membre*

    Gratuit

* meilleur tarif applicable selon le type d'adhésion (voir le détail des avantages des adhésions individuelles et collectives)

Détails

  • Titre original : Thermal management in electronic systems using the inverse piezoelectric effect: A comprehensive review.
  • Identifiant de la fiche : 30034376
  • Langues : Anglais
  • Sujet : Technologie
  • Source : International Journal of Refrigeration - Revue Internationale du Froid - vol. 179
  • Date d'édition : 11/2025
  • DOI : http://dx.doi.org/https://doi.org/10.1016/j.ijrefrig.2025.08.010

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