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Techniques de gestion thermiques intégrées pour des dispositifs électroniques de pointe.

Integrated thermal management techniques for high power electronic devices.

Auteurs : MCGLEN R., JACHUCK R., LIN S.

Type d'article : Article

Résumé

Within the electronics industry, miniaturization of silicon components and enhanced performance have led to high power electronic devices with high packing densities. This has identified the future development of very high heat flux components. This article reviews the development of micro-processing technology and presents a project being carried out to develop combined two-phase heat transfer and heat pipe technology with forced air convection and liquid condenser systems. It also presents a research project being carried out at Newcastle University to develop micro-channel heat exchanger technology.

Détails

  • Titre original : Integrated thermal management techniques for high power electronic devices.
  • Identifiant de la fiche : 2004-2744
  • Langues : Anglais
  • Source : Applied Thermal Engineering - vol. 24 - n. 8-9
  • Date d'édition : 06/2004

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