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Integrated thermal management techniques for high power electronic devices.

Author(s) : MCGLEN R., JACHUCK R., LIN S.

Type of article: Article

Summary

Within the electronics industry, miniaturization of silicon components and enhanced performance have led to high power electronic devices with high packing densities. This has identified the future development of very high heat flux components. This article reviews the development of micro-processing technology and presents a project being carried out to develop combined two-phase heat transfer and heat pipe technology with forced air convection and liquid condenser systems. It also presents a research project being carried out at Newcastle University to develop micro-channel heat exchanger technology.

Details

  • Original title: Integrated thermal management techniques for high power electronic devices.
  • Record ID : 2004-2744
  • Languages: English
  • Source: Applied Thermal Engineering - vol. 24 - n. 8-9
  • Publication date: 2004/06

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