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Thermosiphon à boucle diphasique couplé à un stockage de chaleur latente pour le refroidissement des composants électroniques.

Twophase loop thermosiphon coupled with latent heat storage for electronics cooling.

Numéro : 2302

Auteurs : ALBERTSEN B., SPEERFORCK A.

Résumé

In this study, a two-phase loop thermosiphon cooling system is coupled with latent heat storages integrated in the evaporator and investigated experimentally. A test rig using the low-GWP refrigerant R1233zd(E) is set up with a maximum power of 1.3 kW (23.2 W cm−1), supplied by a dummy for the electronic component to be cooled. Dynamic application scenarios are divided into two general categories and examined using respective examples. The results show high potential for changes in the heat sink temperature, whereas varying heat loads are more challenging regarding design and dimensioning of the PCM-evaporator-composites. In both cases, significant improvements can be achieved in terms of temperatures and uncritical operation time.

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Pages : 9 p.

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Détails

  • Titre original : Twophase loop thermosiphon coupled with latent heat storage for electronics cooling.
  • Identifiant de la fiche : 30030651
  • Langues : Anglais
  • Sujet : Technologie
  • Source : 2022 Purdue Conferences. 19th International Refrigeration and Air-Conditioning Conference at Purdue.
  • Date d'édition : 2022

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