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Transfert de chaleur à trois dimensions dans un puits d'extraction thermique à microcanaux : applications à l'emballage de composants électroniques.

Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging.

Auteurs : FEDOROV A. G., VISKANTA R.

Type d'article : Article

Résumé

A three-dimensional model is developed to investigate flow and conjugate heat transfer in the microchannel-based heat sink for electronic packaging applications. The theoretical model developed is validated by comparing the predictions of the thermal resistance and the friction coefficient with available experimental data for a wide range of Reynolds numbers. The detailed temperature and heat flux distributions as well as the average heat transfer characteristics are reported and discussed. The analysis provides a unique fundamental insight into the complex heat flow pattern established in the channel due to combined convection-conduction effects in the three-dimensional setting.

Détails

  • Titre original : Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging.
  • Identifiant de la fiche : 2001-0069
  • Langues : Anglais
  • Source : International Journal of Heat and Mass Transfer - vol. 43 - n. 3
  • Date d'édition : 02/2000

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