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Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging.

Author(s) : FEDOROV A. G., VISKANTA R.

Type of article: Article

Summary

A three-dimensional model is developed to investigate flow and conjugate heat transfer in the microchannel-based heat sink for electronic packaging applications. The theoretical model developed is validated by comparing the predictions of the thermal resistance and the friction coefficient with available experimental data for a wide range of Reynolds numbers. The detailed temperature and heat flux distributions as well as the average heat transfer characteristics are reported and discussed. The analysis provides a unique fundamental insight into the complex heat flow pattern established in the channel due to combined convection-conduction effects in the three-dimensional setting.

Details

  • Original title: Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging.
  • Record ID : 2001-0069
  • Languages: English
  • Source: International Journal of Heat and Mass Transfer - vol. 43 - n. 3
  • Publication date: 2000/02

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