Three-dimensional conjugate heat transfer in the microchannel heat sink for electronic packaging.

A three-dimensional model is developed to investigate flow and conjugate heat transfer in the microchannel-based heat sink for electronic packaging applications. The theoretical model developed is validated by comparing the predictions of the thermal resistance and the friction coefficient with available experimental data for a wide range of Reynolds numbers. The detailed temperature and heat flux distributions as well as the average heat transfer characteristics are reported and discussed. The analysis provides a unique fundamental insight into the complex heat flow pattern established in the channel due to combined convection-conduction effects in the three-dimensional setting.