Mesurages des propriétés thermophysiques d’un nouveau mélange à base de R-744 pour des applications de pompes à chaleur.

Thermophysical property measurements of a novel R-744 blend for heat pump applications.

Résumé

The phase down of high Global Warming Potential (GWP) refrigerants has encouraged the development of alternative low GWP refrigerants. R-744 has rekindled the interest of suppliers and end users because of its low cost, very low GWP and its non-flammability. These favorable properties notwithstanding, it operates at much higher pressures than fluorocarbon refrigerants and its energy efficiency is penalised by higher ambient temperatures. This study develops a novel refrigerant based on R-744 with added fluorocarbons to reduce pressure and improve efficiency. This blend, “LFR3” comprises R-744 (carbon dioxide); R-32 (difluoromethane) and R-1132a (1,1-difluoroethylene). It is non-flammable and its GWP is less than 150 making it a potentially attractive candidate for use in mobile or stationary heat pump applications or in other applications where R-744 technology has been successfully developed and used. As part of the blend design process a thermodynamic model for the fluid has been developed, including experimental measurement of the blend’s vapor pressure and critical point. Vapor pressure data for the three binary pairs that may be formed from the blend components have been measured from -70 °C to +20 °C. The phase equilibrium data have been regressed using the Peng-Robinson equation of state and Wong-Sandler mixing rules. The paper presents comparison of the experimental and modelled data for the ternary blend and for the binary pairs with each of the phase equilibrium models.

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Pages : 9 p.

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Détails

  • Titre original : Thermophysical property measurements of a novel R-744 blend for heat pump applications.
  • Identifiant de la fiche : 30030736
  • Langues : Anglais
  • Sujet : Technologie, Alternatives aux HFC
  • Source : 2022 Purdue Conferences. 19th International Refrigeration and Air-Conditioning Conference at Purdue.
  • Date d'édition : 2022

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