Partager

Optimisation et comparaison de puits thermiques à micro-canaux à double couche et double paroi avec des nanofluides pour le refroidissement des composants électroniques.

Optimization and comparison of double-layer and double-side micro-channel heat sinks with nanofluid for power electronics cooling.

Auteurs : SAKANOVA A., YIN S., ZHAO J., et al.

Type d'article : Article

Résumé

The tendency of increasing power rating and shrinking size of power electronics systems requires advanced thermal management technology. Introduction of micro-channel heat sink into power electronics cooling has significantly improved the cooling performance. In present work, two advanced micro-channel structures, i.e. double-layer (DL) and double-side (sandwich) with water as coolant, are optimized and compared by computational fluid dynamics (CFD) study. The micro-channels are integrated inside the Cu-layer of direct bond copper (DBC). The effects of inlet velocity, inlet temperature, heat flux are investigated during geometry optimization. The major scaling effects including temperature-dependent fluid properties and entrance effect are considered. Based on the optimal geometry, the sandwich structure with counter flow shows a reduction in thermal resistance by 59%, 52% and 53% compared with single-layer (SL), DL with unidirectional flow and DL with counter flow respectively. Water based Al2O3 (with concentration of 1% and 5%) nanofluid is further applied which shows remarkable improvement for wide channels.

Détails

  • Titre original : Optimization and comparison of double-layer and double-side micro-channel heat sinks with nanofluid for power electronics cooling.
  • Identifiant de la fiche : 30011006
  • Langues : Anglais
  • Source : Applied Thermal Engineering - vol. 65 - n. 1-2
  • Date d'édition : 04/2014
  • DOI : http://dx.doi.org/10.1016/j.applthermaleng.2014.01.005

Liens


Voir d'autres articles du même numéro (18)
Voir la source

Indexation