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Puits thermique pour des ensembles électroniques à microcanaux refroidis à l'aide d'un liquide monophasique.

Single-phase liquid cooled microchannel heat sink for electronic packages.

Auteurs : ZHANG H. Y., PINJALA D., WONG T. N., et al.

Type d'article : Article

Résumé

The study of a single-phase liquid cooled microchannel heat sink for electronic packages is reported. A liquid-cooled aluminium heat sink was designed and fabricated. The microchannel heat sink was assembled onto the chip, using a thermal interface material to reduce the contact thermal resistance at the interface. An analytical method that takes into account the simultaneous developing flow in microchannel heat sinks is developed to predict the pressure drop and thermal resistance. The calculations agree well with the measured pressure drop and thermal resistances. The respective thermal resistance elements are also analysed and presented.

Détails

  • Titre original : Single-phase liquid cooled microchannel heat sink for electronic packages.
  • Identifiant de la fiche : 2005-1746
  • Langues : Anglais
  • Source : Applied Thermal Engineering - vol. 25 - n. 10
  • Date d'édition : 07/2005

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