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Single-phase liquid cooled microchannel heat sink for electronic packages.

Author(s) : ZHANG H. Y., PINJALA D., WONG T. N., et al.

Type of article: Article

Summary

The study of a single-phase liquid cooled microchannel heat sink for electronic packages is reported. A liquid-cooled aluminium heat sink was designed and fabricated. The microchannel heat sink was assembled onto the chip, using a thermal interface material to reduce the contact thermal resistance at the interface. An analytical method that takes into account the simultaneous developing flow in microchannel heat sinks is developed to predict the pressure drop and thermal resistance. The calculations agree well with the measured pressure drop and thermal resistances. The respective thermal resistance elements are also analysed and presented.

Details

  • Original title: Single-phase liquid cooled microchannel heat sink for electronic packages.
  • Record ID : 2005-1746
  • Languages: English
  • Source: Applied Thermal Engineering - vol. 25 - n. 10
  • Publication date: 2005/07

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