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Document IIF

Recherches sur un micro-éjecteur supersonique pour le système de refroidissement de composants électroniques.

Investigations of supersonic micro-ejector for cooling system of electronic components.

Numéro : 0788

Auteurs : SMIERCIEW K., BUTRYMOWICZ D., KARWACKI J., BERGANDER M. J., GAGAN J.

Résumé

Innovative approach for electronics cooling was proposed, i.e. heat generated by a part of electronic equipment, e.g. CPU, is absorbed by heat driven micro-ejector refrigeration system that can provide cooling of other electronic components, e.g. GPU. It was demonstrated the procedure of design, fabrication, and experimentation on the supersonic micro-ejectors for the case of isobutane as a working fluid for such system. For the discussed micro-ejector entrainment ratio obtained was app. 0.20 under conditions of the motive heat source temperature app. 60 °C and evaporation temperature app. 22 °C. For reported tests conditions the boundary temperature of the on-design operation condition was between 21 – 25 °C. CFD technique used for numerical predictions of the ejector performance fits to experimental measured values with acceptable accuracy.

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Format PDF

Pages : 10 p.

Disponible

  • Prix public

    20 €

  • Prix membre*

    Gratuit

* meilleur tarif applicable selon le type d'adhésion (voir le détail des avantages des adhésions individuelles et collectives)

Détails

  • Titre original : Investigations of supersonic micro-ejector for cooling system of electronic components.
  • Identifiant de la fiche : 30031668
  • Langues : Anglais
  • Sujet : Technologie
  • Source : Proceedings of the 26th IIR International Congress of Refrigeration: Paris , France, August 21-25, 2023.
  • Date d'édition : 21/08/2023
  • DOI : http://dx.doi.org/10.18462/iir.icr.2023.0788

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