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Investigations of supersonic micro-ejector for cooling system of electronic components.

Number: 0788

Author(s) : SMIERCIEW K., BUTRYMOWICZ D., KARWACKI J., BERGANDER M. J., GAGAN J.

Summary

Innovative approach for electronics cooling was proposed, i.e. heat generated by a part of electronic equipment, e.g. CPU, is absorbed by heat driven micro-ejector refrigeration system that can provide cooling of other electronic components, e.g. GPU. It was demonstrated the procedure of design, fabrication, and experimentation on the supersonic micro-ejectors for the case of isobutane as a working fluid for such system. For the discussed micro-ejector entrainment ratio obtained was app. 0.20 under conditions of the motive heat source temperature app. 60 °C and evaporation temperature app. 22 °C. For reported tests conditions the boundary temperature of the on-design operation condition was between 21 – 25 °C. CFD technique used for numerical predictions of the ejector performance fits to experimental measured values with acceptable accuracy.

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Details

  • Original title: Investigations of supersonic micro-ejector for cooling system of electronic components.
  • Record ID : 30031668
  • Languages: English
  • Subject: Technology
  • Source: Proceedings of the 26th IIR International Congress of Refrigeration: Paris , France, August 21-25, 2023.
  • Publication date: 2023/08/21
  • DOI: http://dx.doi.org/10.18462/iir.icr.2023.0788

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