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Refroidissement des dispositifs électroniques en utilisant des matériaux à changement de phase.

Cooling of mobile electronic devices using phase change materials.

Auteurs : TAN F. L., TSO C. P.

Type d'article : Article

Résumé

An experimental study is conducted on the cooling of mobile electronic devices, such as personal digital assistants (PDAs) and wearable computers, using a heat storage unit (HSU) filled with the phase change material of n-eicosane inside the device. The high latent heat of n-eicosane in the HSU absorbs the heat dissipation from the chips and can maintain the chip temperature below the allowable service temperature of 50 °C for 2 h of transient operations of the PDA. The heat dissipation of the chips inside a PDA and the orientation of the HSU are experimentally investigated in the paper. It was found that different orientations of the HSU inside the PDA could affect significantly the temperature distribution.

Détails

  • Titre original : Cooling of mobile electronic devices using phase change materials.
  • Identifiant de la fiche : 2004-2462
  • Langues : Anglais
  • Source : Applied Thermal Engineering - vol. 24 - n. 2-3
  • Date d'édition : 02/2004

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