Refroidissement des microprocesseurs avec des micro-puits thermiques évaporatifs : nouveaux développements et perspectives en termes de conservation d'énergie pour des centres de données respectueux de l'environnement.
Refrigerated cooling of microprocessors with micro-evaporation heat sinks: new developments and energy conservation prospects for green data centers.
Auteurs : THOME J. R., BRUCH A.
Résumé
Cooling of data center servers and blade centers is undergoing a vast technological change away from air-cooling technology with its large refrigeration loads towards more energy efficient means. One of the front-runner replacement technologies under development is the use of micro-evaporator heat sinks placed directly on the microprocessor and memory chips. In such a two-phase cooling system, the refrigerant is circulated in multi-micro-channels either by a liquid pump (which allows free cooling nearly all year at many locations as heat is rejected at 50-65°C) or by a compressor (which rejects the heat at about 90°C). In both cases, the heat can potentially be used for heating of the building, building utilities (hot water) and other nearby process/industrial applications. The key component of all this technology is the micro-evaporator. This paper describes the basic overall design of such systems and provides a specific description of micro-evaporators and the status of their thermal design and simulation for use in "green data centers" with a greatly reduced CO2 footprint.
Détails
- Titre original : Refrigerated cooling of microprocessors with micro-evaporation heat sinks: new developments and energy conservation prospects for green data centers.
- Identifiant de la fiche : 2009-1763
- Langues : Anglais
- Sujet : Technologie
- Source : The Institute of Refrigeration: annual proceedings. Volume 105, 2008-2009.
- Date d'édition : 2008
Liens
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Indexation
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Silicon microchannel cooling for high power chips.
- Auteurs : COLGAN E. G., FURMAN B., GAYNES M., et al.
- Date : 12/2006
- Langues : Anglais
- Source : HVAC&R Research - vol. 12 - n. 4
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A closed-loop electronics cooling by implementi...
- Auteurs : BINTORO J. S., AKBARZADEH A., MOCHIZUKI M.
- Date : 12/2005
- Langues : Anglais
- Source : Applied Thermal Engineering - vol. 25 - n. 17-18
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HVAC issues for data centres.
- Auteurs : PATTERSON M. K., STEINBRECHER R., MONTGOMERY S., et al.
- Date : 04/2005
- Langues : Anglais
- Source : ASHRAE Journal - vol. 47 - n. 4
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Liquid cooling architectures for computer syste...
- Auteurs : ELLSWORTH M. J., SCHMIDT R. R.
- Date : 23/06/2007
- Langues : Anglais
- Source : ASHRAE Transactions. 2007 Annual Meeting, Long Beach, CA. Volume 113, part 2 + CD-ROM.
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Thermal profile of a high-density data centre: ...
- Auteurs : SCHMIDT R. R.
- Date : 2004
- Langues : Anglais
- Source : ASHRAE Transactions. 2004 Annual Meeting, Nashville, Tennessee, USA. Volume 110, part 2 + CD-ROM.
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