Refrigerated cooling of microprocessors with micro-evaporation heat sinks: new developments and energy conservation prospects for green data centers.
Author(s) : THOME J. R., BRUCH A.
Summary
Cooling of data center servers and blade centers is undergoing a vast technological change away from air-cooling technology with its large refrigeration loads towards more energy efficient means. One of the front-runner replacement technologies under development is the use of micro-evaporator heat sinks placed directly on the microprocessor and memory chips. In such a two-phase cooling system, the refrigerant is circulated in multi-micro-channels either by a liquid pump (which allows free cooling nearly all year at many locations as heat is rejected at 50-65°C) or by a compressor (which rejects the heat at about 90°C). In both cases, the heat can potentially be used for heating of the building, building utilities (hot water) and other nearby process/industrial applications. The key component of all this technology is the micro-evaporator. This paper describes the basic overall design of such systems and provides a specific description of micro-evaporators and the status of their thermal design and simulation for use in "green data centers" with a greatly reduced CO2 footprint.
Details
- Original title: Refrigerated cooling of microprocessors with micro-evaporation heat sinks: new developments and energy conservation prospects for green data centers.
- Record ID : 2009-1763
- Languages: English
- Subject: Technology
- Source: The Institute of Refrigeration: annual proceedings. Volume 105, 2008-2009.
- Publication date: 2008
Links
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Indexing
- Themes: Air conditioning in laboratories and industry
- Keywords: Technology; Electronics; Microchannel; Cooling; Review; Heat source; Process; Microprocessor; Component
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- Author(s) : TRUTASSANAWIN S., CREMASCHI L., GROLL E. A., et al.
- Date : 2006/07/17
- Languages : English
- Source: 2006 Purdue Conferences. 18th International Compressor Engineering Conference at Purdue & 11th International Refrigeration and Air-Conditioning Conference at Purdue [CD-ROM].
- Formats : PDF
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- Author(s) : CADER T., WESTRA L., REGIMBAL K., et al.
- Date : 2006/06/25
- Languages : English
- Source: ASHRAE Transactions. 2006 Annual Meeting, Quebec City, Canada. Volume 112, part 2 + CD-ROM.
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Liquid cooling architectures for computer syste...
- Author(s) : ELLSWORTH M. J., SCHMIDT R. R.
- Date : 2007/06/23
- Languages : English
- Source: ASHRAE Transactions. 2007 Annual Meeting, Long Beach, CA. Volume 113, part 2 + CD-ROM.
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Thermal profile of a high-density data centre: ...
- Author(s) : SCHMIDT R. R.
- Date : 2004
- Languages : English
- Source: ASHRAE Transactions. 2004 Annual Meeting, Nashville, Tennessee, USA. Volume 110, part 2 + CD-ROM.
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Development of a cooling system for high heat d...
- Author(s) : JEON D. S., KIM S. C., KIM Y. L.
- Date : 2009/03/19
- Languages : Korean
- Source: The 3rd Korean Congress of Refrigeration.
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