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Simulateur d’environnement régulé par thermostat (TEE) amélioré pour les tests de charge.

An improved thermostat environment emulator (TEE) for load-based testing.

Numéro : 2599

Auteurs : KIM D., DHILLON P., HORTON W. T., BRAUN J. E.

Résumé

A load-based testing methodology has previously been developed for estimating representative seasonal performance of residential cooling and heating equipment based on dynamic performance measurements in a test laboratory. This method captures dynamic interactions of the test equipment with its embedded controls and building dynamics by continuously updating the indoor psychrometric chamber temperature and humidity based on a virtual building model. During load-based tests, it is critical to provide representative and reproducible test conditions over the thermostat since variations in airflow and temperature distribution across an environmental chamber can affect the thermostat sensing dynamics and can lead to differences in test equipment dynamic performance between different laboratories at the same test conditions. To address this, a thermostat environment emulator (TEE) has been developed. Cheng et al. (2021a) suggested an initial design concept using an air-to-air thermoelectric cooler heat exchanger (TECHX) and investigated its performance. Kim et al. (2022) improved the TEE performance and applicability across different test facilities and investigated seasonal performance ratings determined from load-based testing using the TEE. In this paper, a 3rd generation TEE is introduced that has lower cost and improved cooling performance. An overview of the 3rd generation TEE design and its performance evaluation across varying test conditions is presented. In addition, load-based testing results obtained using the TEE in combination with a closed-loop apparatus are presented for a 2-ton variable-speed heat pump.

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Pages : 10 p.

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Détails

  • Titre original : An improved thermostat environment emulator (TEE) for load-based testing.
  • Identifiant de la fiche : 30033015
  • Langues : Anglais
  • Sujet : Technologie
  • Source : 2024 Purdue Conferences. 20th International Refrigeration and Air-Conditioning Conference at Purdue.
  • Date d'édition : 17/07/2024

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