Document IIF

Conception paramétrique d'un refroidisseur pour une puce de microprocesseur.

Parametric design of a cooler for a micro-processor chip.

Résumé

Effective dissipation of high heat fluxes in reduced spaces is a problem of great interest to many branches of industry. The computer industry is possibly the most attentive observer of the developments of research in this area. The heat fluxes produced by computer chip processors are expected to rise to values of 300 W/cm2 in the very near future, posing a serious problem related to their cooling. Forced vaporization in a micro-heat sink is a promising alternative to the conventional cooling methods and much study is underway to evaluate its possibilities. Presently, a parametric design of a micro-cooler is proposed using the most up-to-date methods to evaluate important quantities, such as critical heat flux and two-phase heat transfer coefficients, and the temperature distribution in the heat sink.

Documents disponibles

Format PDF

Pages : 2005-3

Disponible

  • Prix public

    20 €

  • Prix membre*

    Gratuit

* meilleur tarif applicable selon le type d'adhésion (voir le détail des avantages des adhésions individuelles et collectives)

Détails

  • Titre original : Parametric design of a cooler for a micro-processor chip.
  • Identifiant de la fiche : 2006-0973
  • Langues : Anglais
  • Source : Commercial Refrigeration. Thermophysical Properties and Transfer Processes of Refrigerants. Proceedings of the IIR International Conferences.
  • Date d'édition : 02/08/2005

Liens


Voir d'autres communications du même compte rendu (140)
Voir le compte rendu de la conférence