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Parametric design of a cooler for a micro-processor chip.
Author(s) : CONSOLINI L., THOME J. R.
Summary
Effective dissipation of high heat fluxes in reduced spaces is a problem of great interest to many branches of industry. The computer industry is possibly the most attentive observer of the developments of research in this area. The heat fluxes produced by computer chip processors are expected to rise to values of 300 W/cm2 in the very near future, posing a serious problem related to their cooling. Forced vaporization in a micro-heat sink is a promising alternative to the conventional cooling methods and much study is underway to evaluate its possibilities. Presently, a parametric design of a micro-cooler is proposed using the most up-to-date methods to evaluate important quantities, such as critical heat flux and two-phase heat transfer coefficients, and the temperature distribution in the heat sink.
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Pages: 2005-3
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Details
- Original title: Parametric design of a cooler for a micro-processor chip.
- Record ID : 2006-0973
- Languages: English
- Source: Commercial Refrigeration. Thermophysical Properties and Transfer Processes of Refrigerants. Proceedings of the IIR International Conferences.
- Publication date: 2005/08/02
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Indexing
- Themes: Other industrial applications
- Keywords: Electronics; Design; Cooling; Heat exchanger; Component
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- Date : 2021/05
- Languages : English
- Source: 2021 Purdue Conferences. 18th International Refrigeration and Air-Conditioning Conference at Purdue.
- Formats : PDF
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