Convection mixte dans des cavités rectangulaires ayant divers rapports longueur/diamètre avec des parois latérales isothermes en mouvement et une source de chaleur à flux constant sur la paroi inférieure.
Mixed convection in rectangular cavities at various aspect ratios with moving isothermal side walls and constant flux heat source on the bottom wall.
Auteurs : GUO G., SHARIF M. A. R.
Type d'article : Article
Résumé
Mixed convection heat transfer in a two-dimensional rectangular cavity with constant heat flux from partially heated bottom wall while the isothermal side walls are moving in the vertical direction was studied numerically. The enclosure represents a practical system such as an air-cooled electronic device, where cooling from the sides is expected to be an efficient electronic cooling option. The heat source represents a heater or an electronic component located at the bottom in such an enclosure. Several different values of the heat source length, the aspect ratio of the cavity, as well as symmetric and asymmetric placement of the heat source are considered. All computations were performed for a range of Richardson numbers of 0.1 to 10. The influence of the Richardson number, heat source length, placement of the heat source, and aspect ratio of the cavity, on the maximum temperature and the Nusselt number at the heat source surface is investigated. Results are presented in the form of streamline and isotherm plots as well as the variation of the maximum temperature and Nusselt number at the heat source surface under different conditions. The pressure-velocity coupling in the governing equations was achieved using the well-known SIMPLE method for numerical computation. The computational procedure is based on finite volume collocated mesh. The linear algebraic system of equations was solved sequentially using the strongly implicit procedure.
Détails
- Titre original : Mixed convection in rectangular cavities at various aspect ratios with moving isothermal side walls and constant flux heat source on the bottom wall.
- Identifiant de la fiche : 2004-2725
- Langues : Anglais
- Source : International Journal of thermal Sciences - vol. 43 - n. 5
- Date d'édition : 05/2004
Liens
Voir d'autres articles du même numéro (2)
Voir la source
Indexation
-
Silicon microchannel cooling for high power chips.
- Auteurs : COLGAN E. G., FURMAN B., GAYNES M., et al.
- Date : 12/2006
- Langues : Anglais
- Source : HVAC&R Research - vol. 12 - n. 4
Voir la fiche
-
Thermal computations for electronics: conductiv...
- Auteurs : ELLISON G. N.
- Date : 2011
- Langues : Anglais
Voir la fiche
-
HVAC issues for data centres.
- Auteurs : PATTERSON M. K., STEINBRECHER R., MONTGOMERY S., et al.
- Date : 04/2005
- Langues : Anglais
- Source : ASHRAE Journal - vol. 47 - n. 4
Voir la fiche
-
Liquid cooling architectures for computer syste...
- Auteurs : ELLSWORTH M. J., SCHMIDT R. R.
- Date : 23/06/2007
- Langues : Anglais
- Source : ASHRAE Transactions. 2007 Annual Meeting, Long Beach, CA. Volume 113, part 2 + CD-ROM.
Voir la fiche
-
Thermal profile of a high-density data centre: ...
- Auteurs : SCHMIDT R. R.
- Date : 2004
- Langues : Anglais
- Source : ASHRAE Transactions. 2004 Annual Meeting, Nashville, Tennessee, USA. Volume 110, part 2 + CD-ROM.
Voir la fiche