Étude expérimentale sur l’amélioration des performances thermiques d’une enveloppe qui intègre des matériaux à changement de phase dans une pièce climatisée.
Experimental study on thermal performance improvement of envelop integrated with phase change material in air-conditioned room.
Résumé
Compared with the traditional building envelope, the thermal mass of building envelope integrated with phase change material was increased greatly, which would reduce the building energy consumption, improve thermal comfort, and shift the peak electricity load. Due to latent heat energy storage when phase changing, the wall integrated with PCM can release heat storage or cold storage to maintain the indoor thermal environment for a period of time after closing the air conditioning. This work presents the results of an experimental study of thermal performances of wall integrated with PCM and without PCM when the air condition runs continuously and intermittently. A building with these two kinds of walls is chosen and the inner surface temperature and heat flow are measured. The building have a domestic heat pump as a cooling system. The results show that the PCM can reduce the inner surface temperature 1°C, and reduce the inner surface heat flow about 40% when the air condition runs continuously. When the air condition runs intermittently by the working schedule, the PCM can also reduce the inner surface temperature 1°C, and the cold storage releasing time of wall integrated with PCM is 2 hours longer than wall without PCM. The PCM can improved the thermal performance of building envelop significantly.
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Détails
- Titre original : Experimental study on thermal performance improvement of envelop integrated with phase change material in air-conditioned room.
- Identifiant de la fiche : 30019221
- Langues : Anglais
- Sujet : Environnement
- Source : 2016 Purdue Conferences. 4th International High Performance Buildings Conference at Purdue.
- Date d'édition : 11/07/2016
Liens
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Indexation
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Thèmes :
Transfert de chaleur;
Bâtiments écologiques - Mots-clés : Conductivité thermique; Immeuble; Performance; PCM; Paroi; Optimisation; Isolation
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