Partager

Document IIF

Une comparaison expérimentale entre les performances de soupape de détente modulaire en silicone et de soupape de détente thermique dans un système de conditionnement d'air mobile.

An experimental comparison between performances of modular silicon expansion valve and thermal expansion valve in mobile ac system.

Numéro : pap. n. 137

Auteurs : ZHANG Z., ZHU J., LI W., et al.

Résumé

Modular silicon expansion valve (MSEV) is an electronically controlled expansion valve which has the ability to control the degree of superheat at the outlet of evaporator. This paper studied the effect of evaporator outlet superheat on system performance and compared with a thermal expansion valve (TXV) system. The experiments were carried out in working conditions with environment temperature ranging from 27°C to 45°C and, compressor rotational speed ranging from 800-2500 RPM. It is found that under most working conditions the performance of MSEV system is better than that of TXV system, the maximum improvement of cooling capacity compared to TXV system is 19% while the COP is almost the same. Through the optimization of superheat at evaporator outlet, a much better system performance can be achieved.

Documents disponibles

Format PDF

Pages : 8 p.

Disponible

  • Prix public

    20 €

  • Prix membre*

    Gratuit

* meilleur tarif applicable selon le type d'adhésion (voir le détail des avantages des adhésions individuelles et collectives)

Détails

  • Titre original : An experimental comparison between performances of modular silicon expansion valve and thermal expansion valve in mobile ac system.
  • Identifiant de la fiche : 30015274
  • Langues : Anglais
  • Source : Proceedings of the 24th IIR International Congress of Refrigeration: Yokohama, Japan, August 16-22, 2015.
  • Date d'édition : 16/08/2015
  • DOI : http://dx.doi.org/10.18462/iir.icr.2015.0137

Liens


Voir d'autres communications du même compte rendu (657)
Voir le compte rendu de la conférence

Indexation