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Investigation on heat pipe/vapor compression integrated system based on a novel parallel-flow three-fluid heat exchanger for data center free cooling. 

Author(s) : ZHANG H., WU Q., LI Y., CHEN X., DING T., LI Z., BOLTAYEV O., ISOKHODJAEV K., ZHOU H., FENG Y.

Type of article: IJR article

Summary

The heat pipe/vapor compression integrated system has significant application potential in the field of energy- efficient cooling for data centers. To address the different optimal refrigerant charge amount between the heat pipe and vapor compression loop in current systems, a novel integrated refrigeration system utilizing a new parallel-flow three-fluid heat exchanger was proposed and investigated. The optimal filling ratio for the heat pipe loop was determined as 48.8%. Under constant evaporator air flowrates, the superheat of the evaporator and the supercooling of the condenser decreased with the increase of outdoor temperature. In compressor-off mode when the outdoor temperatures ranged from -5 ◦ ◦ C to 35 ◦ C to 15 ◦ C, the cooling capacity ranged from 2.66–10.4 kW with an energy efficiency ratio (EER) of 4.47–25.54. With compressor-on mode when the outdoor temperatures ranged from 15 C, the cooling capacity reached 6.66–13.6 kW with an EER of 2.60–5.49. The annual energy consumption of the integrated system was simulated in different climate zones in China and compared with a traditional air conditioner and an integrated refrigeration system. The annual energy-saving rate was 3.9%- 35.1% relative to the traditional air conditioner, and up to 16.23% improvement over the integrated refriger ation system. This demonstrates successful integration of vapor compression and heat pipe technologies, with promising application potential in energy-efficient data center cooling.

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Details

  • Original title: Investigation on heat pipe/vapor compression integrated system based on a novel parallel-flow three-fluid heat exchanger for data center free cooling. 
  • Record ID : 30034966
  • Languages: English
  • Subject: Technology
  • Source: International Journal of Refrigeration - Revue Internationale du Froid - vol. 188
  • Publication date: 2026/08

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