Summary
As the chip power continuous to increase, traditional passive heat dissipation techniques are becoming obsolete and new active cooling techniques are becoming necessary. Among various new active cooling techniques, the vapor compression refrigeration (VCR) system is the leading technology. This paper presents a miniature VCR system for electronics cooling. The dimension of the system is 300 × 230 × 70 mm3 and its cooling capacity is 200 W. It includes a commercial miniature compressor, a capillary tube, a custom-made condenser and a cold plate. The system is tested systematically by experiments. The results indicate that the temperature of the cold plate can be maintained at about 60°C for hours as required in electronics cooling. Moreover, the second-law efficiency of the system is about 31%. [Reprinted with permission from Elsevier. Copyright, 2010].
Details
- Original title: Design and experimental study of a miniature vapor compression refrigeration system for electronics cooling.
- Record ID : 30003269
- Languages: English
- Source: Applied Thermal Engineering - vol. 31 - n. 2-3
- Publication date: 2011/02
- DOI: http://dx.doi.org/10.1016/j.applthermaleng.2010.09.030
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Optimización del diseño de compresores en minia...
- Author(s) : SATHE A. A., GROLL E. A., GARIMELLA S. V.
- Date : 2009/06
- Languages : Spanish
- Source: Frío Calor Aire acondicionado - vol. 37 - n. 415
- Formats : PDF
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Design optimization of electrostatically actuat...
- Author(s) : SATHE A. A., GROLL E. A., GARIMELLA S. V.
- Date : 2008/07/14
- Languages : English
- Source: 2008 Purdue Conferences. 19th International Compressor Engineering Conference at Purdue & 12th International Refrigeration and Air-Conditioning Conference at Purdue [CD-ROM].
- Formats : PDF
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Development of a cooling unit for high ambient ...
- Author(s) : RIBEIRO G. B.
- Date : 2012/07/16
- Languages : English
- Source: 2012 Purdue Conferences. 14th International Refrigeration and Air-Conditioning Conference at Purdue.
- Formats : PDF
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Development of a cooling system for high heat d...
- Author(s) : JEON D. S., KIM S. C., KIM Y. L.
- Date : 2009/03/19
- Languages : Korean
- Source: The 3rd Korean Congress of Refrigeration.
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ADVANCED ELECTRONICS COOLING.
- Author(s) : ROBERTSON G. F.
- Date : 1991/08/10
- Languages : English
- Source: New challenges in refrigeration. Proceedings of the XVIIIth International Congress of Refrigeration, August 10-17, 1991, Montreal, Quebec, Canada.
- Formats : PDF
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