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Numerical model and experimental validation of a heat pipe integrated aluminum radiator for space cooling.

Number: 18050

Author(s) : IŞIKSAÇAR S. N., ERBAS M., KAPILAN N., BIYIKOĞLU A.

Summary

This study investigated the feasibility of using a single segment of a heat‑pipe‑integrated aluminum Panel Convector Panel (PCP) radiator as a space‑cooling terminal through computational fluid dynamics (CFD). The analysis was performed on a half panel segment using a symmetry boundary condition, and a cooling boundary was applied to the panel’s top surface. The model accounted for conduction, natural convection, and radiation simultaneously. To properly represent convective interaction with the ambient air, gravity was activated and a near‑panel air domain was modelled. For a radiator segment with dimensions of 1000 mm × 600 mm × 40 mm , the analysis was carried out in the environment under appropriate boundary conditions. Experimental validation was carried out in the Thermal Sciences Laboratory of Gazi University, in a test room compliant with TS EN 442 and equipped in accordance with ANSI/ASHRAE‑138. The solution provided temperature and velocity distributions of the room air interacting with the radiator elements, streamline patterns, and distributions of the local convective heat transfer coefficient on the panel surfaces. In addition, the average and local heat flux extracted from the panel surfaces was computed, and the panel‑scale cooling capacity was quantified. The findings demonstrated the applicability of the heat‑pipe radiator segment for space cooling in terms of the numerically predicted heat transfer performance and surface temperature fields.

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Pages: 9 p.

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Details

  • Original title: Numerical model and experimental validation of a heat pipe integrated aluminum radiator for space cooling.
  • Record ID : 30034710
  • Languages: English
  • Subject: Technology
  • Source: 9th IIR International Conference on Sustainability and the Cold Chain. Proceedings: April 12-14 2026
  • Publication date: 2026/04
  • DOI: http://dx.doi.org/10.18462/iir.iccc.2026.8050

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