Share

THERMALLY OPTIMUM SPACING OF VERTICAL, NATURAL CONVECTION COOLED, PARALLEL PLATES.

Author(s) : COHEN A. bar-, ROHSENOW W. M.

Type of article: Article

Summary

WHILE COMPONENT DISSIPATION PATTERNS AND SYSTEM OPERATING MODES VARY WIDELY, MANY ELECTRONIC PACKAGING CONFIGURATIONS CAN BE MODELED BY SYMMETRICALLY OR ASYMMETRICALLY ISOTHERMAL OR ISOFLUX PLATES. THE IDEALIZED CONFIGURATIONS ARE AMENABLE TO ANALYTIC OPTIMIZATION BASED ON MAXIMIZING TOTAL HEAT TRANSFER PER UNIT VOLUME OR UNIT PRIMARY AREA. THE MATHEMATICAL DEVELOPMENT AND VERIFICATION OF RELATIONS AS WELL AS THE FORMULATION AND SOLUTION OF THE OPTIMIZING EQUATIONS FOR THE VARIOUS BOUNDARY CONDITIONS CONSTITUTE THE CORE OF THIS PRESENTATION.

Details

  • Original title: THERMALLY OPTIMUM SPACING OF VERTICAL, NATURAL CONVECTION COOLED, PARALLEL PLATES.
  • Record ID : 1985-0084
  • Languages: English
  • Source: J. Heat Transf. - vol. 106 - n. 1
  • Publication date: 1984/02
  • Document available for consultation in the library of the IIR headquarters only.

Links


See other articles in this issue (9)
See the source

Indexing