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Using the double heat-flux meter method to measure thermal conductivity and thermal contact resistance of solid material simultaneously at low temperature and vacuum.

Author(s) : XU L., WANG W. Y., ZHANG T., et al.

Summary

The authors introduce the principle and structure of an experimental apparatus which can measure thermal conductivity and contact resistance of solid materials at low temperature and vacuum by the double heat flux meter method. Advantages and drawbacks of this device are exposed, as well as its accuracy.

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Details

  • Original title: Using the double heat-flux meter method to measure thermal conductivity and thermal contact resistance of solid material simultaneously at low temperature and vacuum.
  • Record ID : 2000-1230
  • Languages: English
  • Source: 20th International Congress of Refrigeration: Refrigeration into the Third Millennium.
  • Publication date: 1999/09/19

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