Main menu
Search results
Search in FRIDOC
76 results
IIR document
Study on material arrangement of multi-layered active magnetic regenerator with lanthanum compound materials.
Study on the configuration of multi-layered active magnetic regenerator with lanthanum compound materials for magnetic heat pump devices.
Substitutional and interstitial modulation of La-Fe-Si structure discussed with hydrogen sorption kinetics.
Properties of La(Fe, Si)13 Magnetocaloric compounds prepared by reactive spark plasma sintering.
Interstitial modification of La(Fe,Si)13 phase by acid solutions.
Epoxy-bonded La(Fe,Mn,Si)13Hz as a multilayered active magnetic regenerator.
High-temperature hydrogenation behaviors and magnetocaloric properties of LaFe11.6Si1.4 compound.
Influence of binder and curing process on the magnetocaloric properties of bonded LaFeSiH alloys.
Experimental investigation of fifteen-layer epoxy-bonded La(Fe,Mn,Si)13Hy active magnetic regenerator.
Freeze-casting to create directional micro-channels in regenerators for magnetic refrigeration.
Powder, process parameters and heat treatment conditions for Laser Beam Melting of LaFeSi-based alloys.
Fast synthesis and magnetocaloric properties of La(Fe, Co, Si)13 compounds and their hydrides.
Recent experimental results of first order LaFeSi-based magnetocaloric materials in an Active Magnetic Regeneration device.
LaFeSi-based magnetocaloric material analysis: Cyclic endurance and thermal performance results.
Double perovskites for room temperature magnetocaloric tasks.
Refrigeration sector monitoring
2 results
A possible major step in the quest of room-temperature superconductivity
Two researcher teams have just reported experiments indicating that a hydride of lanthanum compressed to 1.7 to 1.85 million bar has a critical temperature of 250–260 K (-23 – -13°C).
New magnetic nanocooling technology decreases the environmental impact of cooling and avoids side effects of magnetic fields on electronics
Researchers from the University of Cambridge, UK, and CICnanoGUNE in Spain have developed new cooling technology for the thermal management of computer chips and other miniaturized devices. It utilizes materials that change temperature when...