ShareNew magnetic nanocooling technology decreases the environmental impact of cooling and avoids side effects of magnetic fields on electronics
Researchers from the University of Cambridge, UK, and CICnanoGUNE in Spain have developed new cooling technology for the thermal management of computer chips and other miniaturized devices. It utilizes materials that change temperature when exposed to magnetic fields.
Researchers from the University of Cambridge, UK, and CICnanoGUNE in Spain have developed new cooling technology for the thermal management of computer chips and other miniaturized devices. It utilizes materials that change temperature when exposed to magnetic fields. Materials just 20 nm thick and comprised of lanthanum, calcium, manganese and oxygen were developed for the experiment.
According to Dr Luis Hueso of CICnanoGUNE, the new technique creates an effect “similar to that of a magnetic field” by “straining the material and then relaxing it…thus inducing the magnetocaloric effect responsible for cooling.”
Using this technique, the researchers were able to avoid the negative side effects often associated with combining chips and magnetic fields while creating “a more local and more controlled cooling method…in line with the trend in the miniaturization of technological devices,” Hueso said.
In addition to use in microelectronic components, the research team hopes that the new cooling technology will also help reduce the environmental impact of cooling large data centres.
According to Dr Luis Hueso of CICnanoGUNE, the new technique creates an effect “similar to that of a magnetic field” by “straining the material and then relaxing it…thus inducing the magnetocaloric effect responsible for cooling.”
Using this technique, the researchers were able to avoid the negative side effects often associated with combining chips and magnetic fields while creating “a more local and more controlled cooling method…in line with the trend in the miniaturization of technological devices,” Hueso said.
In addition to use in microelectronic components, the research team hopes that the new cooling technology will also help reduce the environmental impact of cooling large data centres.