Enhanced pool boiling of low-pressure refrigerants on round tubes: an experimental evaluation.

Number: 2350

Author(s) : YANG C., ASHER W., SANDLIN M., NAWAZ K.

Summary

Pool boiling heat transfer is one of the most effective heat transfer methods and crucial for several energy conversion processes such as electronic cooling, steam generation, water purification and thermal management. Enhancing boiling heat transfer around the tubes enables higher heat flux, which can improve the efficiency and lead to compact heat exchangers. Delaying the onset of critical heat flux (CHF) allows for higher CHFs and protects equipment during anomalous transient conditions. Growing interest in process intensification and delayed CHF has motivated the current study. An experimental approach has been deployed to investigate a potential technique to enhance the pool boiling performance around small diameter tubes by open cell metal foams. The findings for nucleate pool boiling of Novec HFE 7000 on the externally enhanced and smooth tubes are reported. The enhanced tube comprised of compressed aluminum foam brazed around. All the samples were horizontally oriented, and the experiments were performed under ambient pressure conditions. The heat transfer measurements for the smooth tubes were compared with several existing correlations and established the baseline. The preliminary results showed that the aluminum foam effectively enhanced the heat transfer coefficient and delayed the onset of critical heat flux. In addition, the pool boiling process around the round tube sample was visualized from both side and front views to comprehend the heat transfer mechanisms underlying substantial enhancement observed during experiments.

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Pages: 10 p.

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Details

  • Original title:  Enhanced pool boiling of low-pressure refrigerants on round tubes: an experimental evaluation.
  • Record ID : 30030686
  • Languages: English
  • Subject: Technology
  • Source: 2022 Purdue Conferences. 19th International Refrigeration and Air-Conditioning Conference at Purdue.
  • Publication date: 2022

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