Share

COOLING OF HIGH POWER DENSITY ELECTRONIC CHIPS.

Author(s) : CHRYSLER G. M., CHU R. C.

Type of article: Article

Summary

THE FIRST PART OF THE PAPER PRESENTS A SUMMARY OF COOLING TECHNOLOGY FOR HIGH POWER DENSITY ELECTRONIC CHIPS AT ROOM TEMPERATURE. BOTH IMMERSION AND CONDUCTION COOLING TECHNIQUES ARE INCLUDED. THE SECOND PART OF THIS PAPER IS A SURVEY OF LOW TEMPERATURE COOLING TECHNOLOGY FOR ELECTRONICS AS PUB-LISHED BY BOTH UNIVERSITY RESEARCHERS AND INDUSTRY PRACTITIONERS. THE FINAL PART OF THE PAPER IS AN OUTLINE OF A LOGICAL EXTENSION OF ROOM TEMPERATURE COOLING TECHNOLOGY TO THE LIQUID NITROGEN TEMPERATURE REGIME.

Details

  • Original title: COOLING OF HIGH POWER DENSITY ELECTRONIC CHIPS.
  • Record ID : 1991-2013
  • Languages: English
  • Source: Adv. cryog. Eng. - vol. 35 A
  • Publication date: 1990
  • Document available for consultation in the library of the IIR headquarters only.

Links


See other articles in this issue (47)
See the source

Indexing