COOLP: a computer program for the design and analysis of ceiling cooling panels.

Author(s) : KILKIS B. I.

Summary

The success of a panel cooling system largely depends on careful analysis of anticipated indoor conditions and proper design. Cooling performance of the panel and its surface temperature distribution at various indoor and outdoor conditions must be simulated in order to assure proper functioning without surface condensation. This makes it essential to develop software to manipulate all relevant design variables, retaining sufficient simplicity so that the program will be welcomed by designers. Using a quasi-steady-state heat transfer model, a computer program was developed in order to provide a design and analysis tool for ceiling cooling panels.

Details

  • Original title: COOLP: a computer program for the design and analysis of ceiling cooling panels.
  • Record ID : 1996-3622
  • Languages: English
  • Source: ASHRAE Transactions.
  • Publication date: 1995/06/24
  • Document available for consultation in the library of the IIR headquarters only.

Links


See other articles from the proceedings (79)
See the conference proceedings