Development of an in-situ system and analysis procedure for measuring ground thermal properties.
Author(s) : AUSTIN W. A., YAVUZTURK C., SPITLER J. D.
Summary
The ground thermal properties strongly influence the initial cost to install a GSHP system. In order to be able to predict ground thermal properties, an experimental apparatus has been built capable of imposing a heat flux on a test borehole and measuring its temperature response. Parameter estimation techniques in conjunction with a two-dimensional numerical model are used to determine the thermal conductivity of the surrounding ground. Independent measurements of the soil conductivity test results are reported.
Details
- Original title: Development of an in-situ system and analysis procedure for measuring ground thermal properties.
- Record ID : 2001-1047
- Languages: English
- Source: ASHRAE Transactions. 2000 Winter Meeting, Dallas, Texas + CD-ROM.
- Publication date: 2000
- Document available for consultation in the library of the IIR headquarters only.
Links
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Indexing
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Themes:
Heat pumps techniques;
Other heat-pump applications - Keywords: Thermal property; Measurement; Ground; Process; Heat pump; Development
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In situ measurement of ground thermal conductiv...
- Author(s) : WITTE H. J. L., GELDER G. J. van, SPITLER J. D.
- Date : 2002
- Languages : English
- Source: ASHRAE Transactions. 2002 Winter Meeting, Atlantic City, New Jersey. Volume 108, part 1 + CD-ROM.
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Ground thermal conductivity testing: controlled...
- Author(s) : MARTIN C. A., KAVANAUGH S. P.
- Date : 2002/01/12
- Languages : English
- Source: ASHRAE Transactions. 2002 Winter Meeting, Atlantic City, New Jersey. Volume 108, part 1 + CD-ROM.
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Field tests for ground thermal properties: meth...
- Author(s) : KAVANAUGH S. P.
- Date : 2000
- Languages : English
- Source: ASHRAE Transactions. 2000 Winter Meeting, Dallas, Texas + CD-ROM.
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A new method to determine the thermal propertie...
- Author(s) : ORNL, SHONDER J. A., BECK J. V.
- Date : 2000/04
- Languages : English
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Temperature changes in underground heat exchang...
- Author(s) : WU X., SUN Y., LIU D., et al.
- Date : 2008/01
- Languages : Chinese
- Source: HV & AC - vol. 38 - n. 207
- Formats : PDF
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