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Numerical study and optimizing on micro square pin-fin heat sink for electronic cooling.

Author(s) : ZHAO J., HUANG S., GONG L., et al.

Type of article: Article

Summary

Micro pin-fin heat sink, characterized by low thermal resistance, compact structure and uniform temperature distribution along the flow direction, is effective and valuable for thermal management of electronic devices. To enhance the cooling performance of the micro square pin-fin heat sink, a geometry optimizing method changing pin-fin porosity and pin-fin located angle is proposed in this paper. The flow and heat transfer characteristics were studied numerically and the geometry of the micro square pin-fin heat sink was optimized. To reveal the characteristics and advantages of the micro square pin-fin heat sink, the comparison between the square pin-fin and the column pin-fin was made. Numerical results indicate that both the pin-fin porosity and located angle are important for the cooling capacity and thermal performance of the micro square pin-fin heat sink; the optimal porosity and located angle for thermal performance are 0.75 and 30° respectively. Furthermore, micro heat sinks with the optimized square pin-fin present better thermal performance than micro column pin-fin heat sinks, which implies that there is great potential to employ micro square pin-fin heat sinks for thermal management on electronic devices with high energy density.

Details

  • Original title: Numerical study and optimizing on micro square pin-fin heat sink for electronic cooling.
  • Record ID : 30017085
  • Languages: English
  • Source: Applied Thermal Engineering - vol. 93
  • Publication date: 2016/01/25
  • DOI: http://dx.doi.org/10.1016/j.applthermaleng.2015.08.105

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