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Experimental investigation of the thermal performance of flat heat pipe heat sink for multi-chip cooling.

[In Chinese. / En chinois.]

Author(s) : HAN X., TIAN Z., HE W., et al.

Type of article: Article

Summary

A novel plat heat pipe heat sink for multi-chip was designed, and the thermal performance of the heat sink in different air speed, chips numbers and positions, heating power was experimentally investigated. The experimental results showed that the maximum heat transport capacity of the heat sink with one, two and three heat sources were 310W, 390 W and 500 W respectively in the horizontal position, and 275 W, 408 W, 500 W in the vertical application when the chips temperature was less than 80°C and the ambient temperature was 20°C. For the flat heat pipe heat sink, multiple chips cooling can dissipate more heat than unique source. The results were found to agree well with the experimental data about the thermal spreading effect of the flat heat pipe. It was shown that flat heat pipe accords with the requirements of electronic devices cooling.

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Pages: 52-56

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